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Definition
| Dynamic RAM (DRAM) is called dynamic because it doesen't hold data, and must constantly be refreshed by the memory controller to hold its data. DRAM is volatile, meaning it loses any data stored within if power is interrupted or cut off. |
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Term
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| Static RAM (SRAM) volatile, but does not need to be refreshed constantly, making it useful for cache memory, its primary usage. SRAM is very fast, but very expensive, which is why it’s used for processor cache. |
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Definition
| Synchronous DRAM (SDRAM) is the foundation of most RAM in use today. SDRAM runs in time with the computer processor and system clock, and is rated by its frequency in MHz or GHz. DIMMs using SDRAM have 168 pins. |
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| Double Data Rate, generally use 184 pins. |
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| Improvements on original DDR, using less power and running at even quicker frequencies than DDR. Generally use 240 pins. |
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| Improvements on DDR2, generally use 240 pins. |
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Term
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Definition
| is a memory manufacturer that developed a proprietary memory standard in the late 1990s for high-performance systems. Rambus memory modules, known as RIMMs, had 184 or 232 pins, could use a 16- or 32-bit bus. |
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| Parity was an error-checking technology used with SIMMs that used a ninth bit that was included with every byte (8 bits) of data. If using parity memory, all SIMMs have to match. |
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Term
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Definition
| Heat sinks are a set of fins that draw heat away from the processor and conduct it out to where it can be dissipated or dispersed. |
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Definition
| A CPU fan can draw heat away from the processor, or blow the heat out from the heat sink. |
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Definition
| Draw heat away from the processor, but for the computer case at large. The layout of the case is generally arranged so a case fan can blow air over the components and draw heat out of the case via unimpeded airflow. |
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Definition
| Use a pump to circulate water or other liquids through tubes that draw heat from the components and out to an area where fans can cool the liquid and recirculate it. |
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Term
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Definition
| Also known as thermal grease, it's a paste-like material that is applied to the top of the processor or bottom of the heat sink before installing. Conducts heat better than air and eliminates air pockets, creating an airtight connection and increasing the ability to draw off heat. |
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